Huizhou Tianyi rare material Co., Ltd

Product classification
  Sputtering Target
  Rare Earth Material
  Evaporation Material
  Chemical Reagent
  High Pure Metals
  Compounds
About TYR
Copper

Copper, Cu

 

Pure Copper, Cu Metal              Copper Alloy            Copper Oxide, CuO, Cu2O        Copper Selenide, Cu2Se, CuSe        Cupper Telluride, Cu2Te, CuTe             

        Copper Nitride, Cu3N     Cupper Sulfide, CuS, Cu2S     Other doped Copper compound (CuO-Al2O3-ZnO, CuO-ZnO, CuNiO3)     

 

Powder   Sputtering Targets    Vacuum Evaporation Material are available

 

Powder-625mesh, -325mesh-200mesh-160mesth, -100mesh e.t.c particle size

Sputtering Targets : Diameter: 355.6mm (14") max. Single piece Size: Length: <254mm, Width: <127mm, Thickness: >1mm, if larger size than this, we can do it as tiles joint by 45 degree or 90 degree

Evaporation MaterialPieces: 1-4mm, 1-6mm, 3-6mm, 3-12mm e.t.c,  Tablets: 8-9mm dia. X 4-5mm thick, 10mm dia. X 10mm thick e.t.c, Pellets: 3mm dia. X 3mm L, 6mm dia. x 6mm L, 6mm dia. X 3mm L e.t.c

 

Applications:

  

 

Pure Copper, Cu Metal                   Material Safety Data SheetMSDSfor Copper, Cu Metal

CAS# ,      Atomic Weight: , Melting Point:   oC , Boiling Point:   oC , Density:  g/cm3. Evaporation Techniques  

Pure Copper, Cu Metal

99.99%, 99.999%

Ingot, Pellets, Granules, Shots, Rods e.t.c application in Thin Film Coating, Sputtering Targets

M.O.Q: 50gram/1 piece

 

Copper Alloy                  

  

Copper, Cu Alloy

Cu-In-Ga-Se,Cu-Ga, Cu-In, W-Cu, Al-Si-Cu, Cu-Zn, Cu-Os, Cu-Ni, Ag-Cu alloy

Ingot, chunks, granules, pieces, rod, discs, plate, foil e.t.c application in Thin Film Coating, Sputtering Targets

M.O.Q: 50gram/1 piece

 

 

Copper Oxide, CuO, Cu2O            Material Safety Data SheetMSDSfor  Copper Oxide, CuO, Cu2O

Applications:  

CAS#       Density:     g/cm3, Melting Point:     oC , Boiling Point:    oC,  Evaporation TechniquesAl2O3 Crucible, W boat

Copper Oxide, CuO, Cu2O

99.9%, 99.99%

Chunks, Pieces, Granules, Rods, Disk, Plate, Sheet, Foil, Powder, Crucibles e.t.c application in Thin Film Coating, Sputtering Targets

M.O.Q: 50gram/1 piece

 

 

Copper Nitride, Cu3N            Material Safety Data SheetMSDSfor Copper Nitride, Cu3N

Applications:  

CAS#               Density: 3.18 g/cm3, Melting Point: 1266 oC , Boiling Point:    oC,  Evaporation Techniques:

Copper Nitride, Cu3N 

99.9% 

Powder

M.O.Q: 50gram/1 piece

 

 

Copper Selenide, Cu2Se, CuSe         Material Safety Data SheetMSDSfor Copper Selenide, Cu2Se, CuSe

Applications:  

CAS#               Density:   g/cm3, Melting Point:   oC , Boiling Point:    oC,  Evaporation Techniques: 

Copper Selenide, Cu2Se, CuSe

99.9% 

PPieces, Granules, Rods, Disk, Plate, Sheet, Foil, Powder, Crucibles e.t.c application in Thin Film Coating, Sputtering Targets

M.O.Q: 50gram/1 piece

 

Cupper Telluride, Cu2Te, CuTe         Material Safety Data SheetMSDSfor Cupper Telluride, Cu2Te, CuTe

Applications:  

CAS#               Density:   g/cm3, Melting Point:   oC , Boiling Point:    oC,  Evaporation Techniques: 

Cupper Telluride, Cu2Te, CuTe

99.9% 

Pieces, Granules, Rods, Disk, Plate, Sheet, Foil, Powder, Crucibles e.t.c application in Thin Film Coating, Sputtering Targets

M.O.Q: 50gram/1 piece

 

 

Cupper Sulfide, CuS, Cu2S       Material Safety Data SheetMSDSfor Cupper Sulfide, CuS, Cu2S 

Applications:  

CAS#               Density:   g/cm3, Melting Point:   oC , Boiling Point:    oC,  Evaporation Techniques: 

Cupper Sulfide, CuS, Cu2S

99.9% 

Pieces, Granules, Rods, Disk, Plate, Sheet, Foil, Powder, Crucibles e.t.c application in Thin Film Coating, Sputtering Targets

M.O.Q: 50gram/1 piece

 

 

Other doped Copper compound:

Other doped Copper compound        

Cu2ZnSnS4, Cu2ZnSnSe4, CuAlO2, CuGeS

Chunks, Pieces, Granules, Rods, Disk, Plate, Sheet, Foil, Powder, Crucibles e.t.c application in Thin Film Coating, Sputtering Targets

M.O.Q: 50gram/1 piece

 

 

Product classification

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